Our design implementation service is available for any foundries' FinFET processes required by customers.

For FinFET process nodes, we have accumulated plenty of experience in 3nm, 4nm, 6nm, 8nm, 14nm, etc. The applied fields include mobile, high-performance computing (HPC), and automotive.

SiNBLE also offers a one-stop service for 2.5D/3D advanced packaging. With robust design flow and experience, we specialize in integrating chiplets and providing support for customized interposer design and testing. In manufacturing, we maintain long-term relationships with tier-1 vendors to ensure the secure allocation of capacity for customers to achieve project success.
Customers can choose preferred process technologies as well as cost-effective solutions for a wide range of applications. Please feel free to contact us for details.

Meet power and performance requirements for faster time-to-market.


Accelerate AI, edge-computing, and server SoCs development.


Simplify computer vision and ADAS chip design needs.