Solutions

Our design implementation service is available for any foundries' FinFET processes required by customers.

For FinFET process nodes, we have accumulated plenty of experience in 3nm, 4nm, 6nm, 8nm, 14nm, etc. The applied fields include mobile, high-performance computing (HPC), and automotive.

SiNBLE also offers a one-stop service for 2.5D/3D advanced packaging. With robust design flow and experience, we specialize in integrating chiplets and providing support for customized interposer design and testing. In manufacturing, we maintain long-term relationships with tier-1 vendors to ensure the secure allocation of capacity for customers to achieve project success.